An Assessment Model of Real-World Hardware Security Attacks” was published by researchers at TU Wien and TÜV Austria. “We ...

Predictive modeling, strategic sampling and embedded monitors help accelerate testing for yield limiting defects.

How in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring ...

SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a ...

A new technical paper titled “Advanced Chiplet Placement and Routing Optimization considering Signal Integrity” was published by researchers at KAIST. Abstract: “This article addresses the critical ...

A new technical paper titled “Hardware-based Heterogeneous Memory Management for Large Language Model Inference” was ...

According to the researchers, the platform can achieve wafer-scale integration of all the devices required to build an ...

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Note: all measurements made with and without temperature.

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; ...

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...