Abstract: A high-performance power supply module for chip applications is presented in this paper using 180nm CMOS technology. The module includes a subsection compensation bandgap reference (BGR) and ...
Abstract: Power module is required to be high power density, high current, high reliability and low loss. Especially for xEV fields, high power density and high current are important. Therefore this ...
Providing utility professionals with critical information related to the planning, design, construction, operations, maintenance and safety of transmission and distribution facilities, including ...
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