Texas Instruments has introduced Microsoft Windows EmbeddedCE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9processors, for Sitara AM1x ARM9 microprocessor units (MPUs), and ...
Boston, MA (USA), October 8th, 2009 – Adeneo Embedded, a Windows Embedded Gold Partner with engineering offices located in Europe and North America, presented its Consumer Internet Device (CID) user ...
Microsoft Corp. on Tuesday said that the latest release of its Windows Embedded CE operating system for handheld devices and gadgets will come with a new development framework that puts the ...