Enables third-party payload manufacturers, as well as U.S. DoD and international partners, to develop and integrate payloads onto RQ-20B Puma Utilizes the Modular Payload Standard initiated by USSOCOM ...
For decades, monolithic system-on-chip (“SoC”) designs defined the semiconductor landscape. Introduced in the 1970s[1] and refined over several generations, SoCs allowed designers to integrate ...
Emerging 2.5G/3G wireless markets are introducing new data types and application performance requirements into the handheld-terminal market. But the market promises to be so dynamic that a new level ...
The OPC UA standard has been expanded by the OPC Foundation to add a RESTful interface that allows remote access to information in more than 90 standardized IT application models. The OPC Foundation ...
The MIPI Alliance recently released MIPI A-PHY v1.0, the first automotive long-reach serializer-deserializer (SerDes) physical layer interface specification. Let me explain what automotive SerDes ...
The automotive industry has experienced significant changes in recent years due to electrification and the growing demand for enhanced safety, comfort, and luxury features. In today’s high-end ...
The Open NAND Flash Interface (ONFI) Working Group today unveiled its first specification aiming to aid with the integration of NAND flash memory into consumer electronics devices, computing platforms ...
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