As the future of microsystems technology converges around three-dimensional heterogeneous integration (3HDI) microelectronics, the scientists, researchers, and engineers working to advance the state ...

Using a through-hole interconnection method to enable the bonding of chips at room temperature, a new stacked-chip technology promises reductions in package thicknesses by more than 60%. The ...

TL;DR: SK hynix is developing High Bandwidth Storage (HBS), combining mobile DRAM and NAND in a single package using innovative Vertical Wire Fan-Out (VFO) technology. This multi-layer stacked memory ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

A new rumour doing the rounds has revealed that the PS6 is set to utilise AMD’s 3D stacked chips, following news that Sony Interactive Entertainment has partnered with the chip manufacturer for ...

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...

Silicon chip manufacturers like Intel and TSMC are constantly outdoing themselves to make ever smaller features, but they are getting closer to the physical limits of silicon. “We already have very, ...