Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...

Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into volume production ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

This week at the IEEE Electronic Components and Packaging Technology Conference, Intel unveiled that it is developing new chip packaging technology that will allow for bigger processors for AI. With ...

Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips. Save my User ID and Password ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

Apple plans to use advanced 3D chip stacking technology in its upcoming MacBook series which is scheduled to be launched in 2025, which is said to be a breakthrough in chip packaging technology. The ...