The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways.

Now available, the latest release of HEIDENHAIN’s PC-based IK 5000 QUADRA-CHEK metrology software (version 3.0.3) provides advanced functionality for both new and used quality control inspection ...

Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications ...