Cleaving is a fast and simple technique used for preparing samples of silicon and other semiconductor materials; however, sapphire, despite being a single crystal material, does not cleave well.

Cleaving is a simple yet rapid method used to prepare samples of silicon and other semiconductor materials; however, despite being a single crystal material, sapphire does not cleave well. Existing ...

LatticeGear has developed a tool to cleave silicon (100) samples counter to the two orthogonal cleaving planes. This is commonly required in the semiconductor industry for manufacturing memory devices ...

Cleaving is a fast and simple method used for preparing samples of semiconductor materials, including silicon. In contrast, sapphire does not cleave well, despite being a single crystal. While sawing ...