The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce packaging costs and relax routing constraints in HBM designsSerialization shifts ...
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SK hynix orders new equipment, possibly for production of next-gen HBM4
SK hynix Inc. has ordered new high bandwidth memory (HBM) production equipment from Hanmi Semiconductor Co., a regulatory ...
TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...
JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...
As memory stocks like Micron trade at a steep discount to the S&P 500, analysts debate whether a historic "bottleneck" in AI ...
For decades, computer chips became smaller and more efficient by shrinking the size of various features and finding ways to pack more transistors into a smaller area of silicon. As die shrinks have ...
We've discussed the capabilities and performance of HBM (High Bandwidth Memory) multiple times over the past six months, but a new report sheds light on the physical architecture and construction of ...
SK Hynix (or "the company") announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time). A large number of ...
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